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Leadframes  Cleaning Leadframes  Cleaning
Discrete device cleaning
Discrete device

Discrete device cleaning

Chip lead frame/discrete device cleaning: Lead frame type discrete devices are welded to the substrate and lead frame separately during chip soldering process. The high-temperature lead-containing solder paste used in this welding poses higher requirements for the cleaning process: removing flux residues and production residues, removing copper surface oxides, and having good compatibility with the frame material and silicon passivation layer. The water-based cleaning agent developed by Unibright perfectly meets the above requirements, creating excellent production conditions for subsequent Bonding.



Unibright provides you with professional chip lead frames/discrete device water-based cleaning process solutions.

Unibright Discrete device cleaning advantages

1. The pH value is neutral, demonstrating excellent material compatibility with sensitive materials such as aluminum, copper, nickel, plastic, and labels.

2. Diluted with deionized water in a certain proportion, it is not easy to foam and can be used in spray and ultrasonic processes.

3. Halogen free, environmentally friendly materials; The odor is light, the liquid used has no flash point, and it is safe to use without the need for additional explosion-proof measures.

4. Due to its neutral pH, it reduces the difficulty of sewage treatment.

Discrete device cleaning recommended products

Discrete device cleaning application

It can Remove flux residues and production residues, also can do removal of copper surface oxides, and good compatibility with frame materials and silicon passivation layers. The water-based cleaning agent developed by Unibright perfectly meets the above requirements, creating excellent production conditions for subsequent Bonding.


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