1. High cleaning load capacity, good filterability, ultra long service life, and low maintenance cost.

2. It can effectively remove residues in the small gaps at the bottom of the components, and the solder joints remain bright after cleaning.

3. The formula is gentle and particularly suitable for cleaning applications with long contact times. No impact on various components on PCBA, with good material compatibility.

4. It does not contain halogens, has no flash point, is safe to use, and does not require additional explosion-proof measures.

5. No foam, suitable for spray cleaning process.

6. It does not contain solid substances, and there is no residue or whitening on the cleaned parts and cleaning equipment.