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    Leadframes  Cleaning Leadframes  Cleaning
    Lead frame cleaning
    Lead frame

    Lead frame cleaning

    Chip lead frame/discrete device cleaning: Lead frame type discrete devices are welded to the substrate and lead frame separately during chip soldering process. The high-temperature lead-containing solder paste used in this welding poses higher requirements for the cleaning process: removing flux residues and production residues, removing copper surface oxides, and having good compatibility with the frame material and silicon passivation layer. The water-based cleaning agent developed by Unibright perfectly meets the above requirements, creating excellent production conditions for subsequent Bonding.



    Unibright provides you with professional chip lead frames/discrete device water-based cleaning process solutions.

    Unibright Lead frame cleaning advantages

    1. The pH value is neutral, demonstrating excellent material compatibility with sensitive materials such as aluminum, copper, nickel, plastic, and labels.

    2. Diluted with deionized water in a certain proportion, it is not easy to foam and can be used in spray and ultrasonic processes.

    3. Halogen free, environmentally friendly materials; The odor is light, the liquid used has no flash point, and it is safe to use without the need for additional explosion-proof measures.

    4. Due to its neutral pH, it reduces the difficulty of sewage treatment.

    Lead frame cleaning recommended products

    Lead frame cleaning application

    Used to remove flux, solder paste, and solder paste residues from PCBA, packaging devices, and power electronics. This product can effectively remove solder paste, solder paste, and flux residues on various semiconductor electronic devices. For flip chip, semiconductor packaging water-based environmental cleaning, PoP stacked chips, SIP system packaging, semiconductor chips, semiconductor power devices, power modules (photoelectric modules, sensing modules, communication modules), power electronics, IGBT power modules, DCB power cleaning, lead frame, BGA ball planting cleaning, discrete devices Electronic components and other components have excellent cleaning effects.



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